WHY E-LINK
WHY E-LINK
| HIGHER WALL THICKNESS OF PIPE | ||
|---|---|---|
| As Wall Thickness Of Pipe Increases, Life Of Earthing System Increase. | ||
| E-LINK | OTHER | |
Preferred
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| HIGHER WALL THICKNESS OF PIPE | ||
|---|---|---|
| As Wall Thickness Of Pipe Increases, Life Of Earthing System Increase. | ||
| E-LINK | OTHER | |
Preferred
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| BIGGER SIZE OF INNER STRIP | ||
|---|---|---|
| As Strip Size Increases, Life And Earth Fault Current Carrying Capacity Increase | ||
| E-LINK | OTHER | |
Preferred
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| COATING ON INNER STRIP | ||
|---|---|---|
| Cu Bonding or HDGI Bonding increases the life and conductivity of earthing system. | ||
| E-LINK | OTHER | |
Preferred
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| SAME SIZE OF STRIP IN INSIDE & OUTSIDE | ||
|---|---|---|
| Outer Side Bigger Strip And Inner Side Smaller Strip Make Earth Electrode Weak In Handling Critical Earth Fault Conditions. | ||
| E-LINK | OTHER | |
Preferred
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| BOTTOM WELDED INNER STRIP | ||
|---|---|---|
| It Provide Required Mechanical Strength During Earth Fault Conditions And Help In Sending Fault Current Deeper. | ||
| E-LINK | OTHER | |
Preferred
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| MATERIAL INSIDE THE PIPE ELECTRODE | ||
|---|---|---|
| Cheaper Products Fill Yellow Soil Inside The Earth Electrode Which Reduces Reliability Of The Earthing System. | ||
| E-LINK | OTHER | |
Preferred
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| TRUE MICRON IN COPPER BONDING | ||
|---|---|---|
| Cheaper Products Often Have Less Micron Coating Against Claim Of Higher Micron Coating. | ||
| E-LINK | OTHER | |
Preferred
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Do Not Purchase Earthing ....Purchase Reliable Earthing